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8 Layer Fr4 circuit board Manufacturing Service

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8 Layer Fr4 circuit board Manufacturing Service

MOQ : 1

Price : Contact us

Payment Terms : T/T

Layer : 8 Layer

Base Material : Fr4

Thickness : 0.5 mm

Copper Thickness : 1.2OZ

Board Size : Customized

Min. Line Width/Space : 0.10/0.10mm

Surface Treatment : ENIG/Immersion Gold

Certificate : UL,IATF16949,ISO&Reach

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8 Layer Fr4 circuit board Manufacturing Service



What's Printed Circuit Board Manufacturing Service?


​​Printed Circuit Board Manufacturing Service​​ refers to the professional process of producing ​​Printed Circuit Boards (PCBs)​​ based on customer designs. PCBs are essential components in electronic devices, providing mechanical support and electrical connections for components like resistors, capacitors, and integrated circuits.



What's Fr4?


FR4 (or FR-4) is a glass-fiber-reinforced epoxy-resin laminate.
It is the most common substrate used to make rigid printed-circuit boards (PCBs).


8 Layer Fr4 circuit board Manufacturing Service 8 Layer Fr4 circuit board Manufacturing Service 8 Layer Fr4 circuit board Manufacturing Service



♦ ​​Key Features of PCB Manufacturing Service:

  • Design Submission​​

Customers provide design files (usually in ​​Gerber format​​, along with drill files, BOM, and assembly drawings).

Engineers review the design for manufacturability (DFM checks).

  • ​​PCB Fabrication Process​​

​​Material Selection​​ – Choosing substrate materials (e.g., FR-4, Rogers, flexible PCBs).

​​Printing & Etching​​ – Transferring the circuit pattern onto copper-clad laminate.

​​Layering & Lamination​​ (for multi-layer PCBs).

​​Drilling & Plating​​ – Creating vias and through-holes.

​​Solder Mask & Silkscreen​​ – Applying protective coating and component labels.

​​Surface Finish​​ – Options like HASL, ENIG, OSP, or immersion silver/gold.

​​Electrical Testing & Inspection​​ – Ensuring no shorts or open circuits (e.g., flying probe test, AOI).

  • ​​Additional Services (Optional)​​

​​PCB Assembly (PCBA)​​ – Soldering components onto the board (SMT or through-hole).

​​Testing & Quality Control​​ – Functional testing, burn-in testing, etc.

​​Box Build & Packaging​​ – Full product assembly.




Technical Parameters


Item

Specification

Laers

1~64

Board thickness

0.1mm-10.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-15 OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.




One-Stop PCBs Solution


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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines


2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%


3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production



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